Mechini ea ho tšoaea laser e sebelisoa ho tšoaea bokaholimo ba lintho tse fapaneng ka ho sa feleng ka mahlaseli a laser. Phello ea ho tšoaea ke ka ho fetoha ha mouoane ha thepa ea bokaholimo e pepesitsoeng thepa e tebileng, e le ho betla mekhoa e metle, matšoao a khoebo le mantsoe, mochini oa ho tšoaea laser o arotsoe haholo-holo ka mochini oa ho tšoaea laser oa CO2, mochini oa ho tšoaea laser oa semiconductor, mochini oa ho tšoaea laser oa fiber le mochini oa ho tšoaea laser oa YAG, mochini oa ho tšoaea laser o sebelisoa haholo-holo litlhokong tse ling tsa liketsahalo tse ntle le tse phahameng tsa ho nepahala. E sebelisoa likarolong tsa elektroniki, potoloho e kopantsoeng (IC), lisebelisoa tsa motlakase, puisano ea mohala oa thekeng, lihlahisoa tsa hardware, lisebelisoa le lisebelisoa, lisebelisoa tsa ho nepahala, lioache tsa khalase le lioache, mabenyane, lisebelisoa tsa likoloi, linotlolo tsa polasetiki, thepa ea kaho, phaephe ea PVC.
Joale litšobotsi tsa mochini oa ho tšoaea laser ke life? Ho na le melao-motheo e 'meli e tsebahalang haholo: "ts'ebetso ea mocheso" e na le matla a mangata a mahlaseli a laser (ke phallo ea matla a kopaneng), mahlaseli holim'a thepa e sebetsitsoeng, bokaholimo ba thepa bo monya matla a laser, ts'ebetso ea ho hlasimolla mocheso sebakeng sa mahlaseli, e le hore bokaholimo ba thepa (kapa ho roala) mocheso o phahame, o hlahise lintho tse sa tloaelehang, tse qhibilihang, tse ntšitsoeng, tse fetohang mouoane le tse ling.
"Ho sebetsa ka serame" ho na le matla a mangata a li-photon (tsa ultraviolet), tse ka robang litlamo tsa lik'hemik'hale linthong (haholo-holo lintho tsa tlhaho) kapa mecha e potolohileng ho fihlela moo ts'ebetso e seng ea mocheso e senyang thepa. Mofuta ona oa ts'ebetso ea serame o na le bohlokoa bo ikhethang ts'ebetsong ea ho ngola mabitso ka laser, hobane ha se ho tlosoa ha mocheso, empa ha e hlahise phello e mpe ea "tšenyo ea mocheso", e roba ho petsoha ha tlamo ea lik'hemik'hale, kahoo lera le ka hare la bokaholimo bo sebetsitsoeng le sebaka se haufi ha le hlahise ho futhumatsa kapa ho fetoha ha mocheso. Mohlala, li-laser tsa excimer li sebelisoa indastering ea lisebelisoa tsa elektroniki ho beha lifilimi tse tšesaane tsa lik'hemik'hale holim'a substrate, ho etsa libaka tse tšesaane substrate ea semiconductor.
Papiso ea mekhoa e fapaneng ea ho tšoaea Ha ho bapisoa le mokhoa oa ho tšoaea oa inkjet, ho taka ka laser ho na le monyetla oa mefuta e mengata ea lits'ebetso, lintho tse fapaneng (tšepe, khalase, letsopa, polasetiki, letlalo, jj.) li ka tšoauoa ka boleng bo phahameng ba kamehla. Ha ho na matla holim'a mosebetsi, ha ho na phetoho ea mechini, ha ho na mafome holim'a thepa.
Tšebeliso ea sehlahisoa e ka betla mefuta e fapaneng ea thepa e seng ea tšepe. E sebelisoa lisebelisoa tsa liaparo, liphutheloana tsa meriana, liphutheloana tsa veine, li-ceramic tsa kaho, liphutheloana tsa lino, ho seha lesela, lihlahisoa tsa rabara, letlapa la khetla, limpho tsa mesebetsi ea matsoho, likarolo tsa elektroniki, letlalo le liindasteri tse ling. 1. E ka betla tšepe le mefuta e fapaneng ea thepa e seng ea tšepe. E loketse haholoanyane litlhoko tse ling tsa ts'ebetso e ntle ea sehlahisoa e nepahetseng. 2. E sebelisoa likarolong tsa elektroniki, potoloho e kopaneng (IC), lisebelisoa tsa motlakase, puisano ea mohala oa thekeng, lihlahisoa tsa hardware, lisebelisoa le lisebelisoa, lisebelisoa tsa ho nepahala, lioache tsa khalase le lioache, mabenyane, lisebelisoa tsa likoloi, linotlolo tsa polasetiki, thepa ea kaho, phaephe ea PVC, lisebelisoa tsa bongaka le liindasteri tse ling. 3. Lisebelisoa tse sebetsang li kenyelletsa: Tšepe le litšepe tse tloaelehileng (tšepe, koporo, aluminium, magnesium, zinki le litšepe tse ling tsohle), litšepe le litšepe tse sa tloaelehang (khauta, silevera, titanium), li-oxide tsa tšepe (mefuta eohle ea li-oxide tsa tšepe ea amoheleha), phekolo e khethehileng ea bokaholimo (phosphating, aluminium anodizing, bokaholimo ba electroplating), thepa ea ABS (khetla ea lisebelisoa tsa motlakase, litlhoko tsa letsatsi le letsatsi), enke (linotlolo tse bonaletsang, lihlahisoa tsa khatiso), Epoxy resin (encapsulation, lera la ho thibela mocheso bakeng sa likarolo tsa elektroniki).
Nako ea poso: Hlakubele-20-2023
