In the field of core, China is in a weak position, many chips need to rely on imports, long-term dependent on others, lack of independent intellectual property rights and upstream and downstream industry chain. During the trade war between China and the United States in recent years, the United States imposed sanctions on China over the chip issue, which made us realize the importance of chips. Then the domestic chip manufacturing difficulties related technologies have been overcome.
Several fields of Chinese information industry technology have made positive progress the breakthrough of information industry technology, with the development of 6G communication technology, our country has stood on top. It has become the main source country of 6G technology patent applications, ranking first in the world.
Soon, China will also have the ability to manufacture high-end chips. We believe that under the continuous accumulation of our innovative technology, the mass production of 7nm chips will soon be realized. Because of the chip problem and stop the development of mobile phones, cars and other technology companies to see hope. What important role does laser cutting machine play in chip manufacturing? In chip manufacturing, wafer is the core raw material of chip, laser cutting function can meet the requirements of wafer cutting, and can effectively avoid the problem of grinding wheel cutting
1, non-contact processing: laser processing only laser beam and processing workpiece contact, no cutting force for cutting parts, to avoid damage to the surface of processing materials. 2, high machining precision, small thermal effect: pulse laser can achieve instantaneous power is very high, high energy density and average power is very low, can be completed instantaneously and the heat affected area is very small, to ensure high precision machining, small heat affected area. 3, high processing efficiency, good economic benefits: laser processing efficiency is often several times of mechanical processing effect and no consumables pollution-free. Laser invisible cutting technology of semiconductor wafer is a new laser cutting technology, which has many advantages, such as fast cutting speed, no dust generation, no substrate consumption, small cutting path required, complete dry process and so on.
The main principle of laser cutting is to focus the short pulse laser beam through the surface of the material in the middle of the material, forming a calcium layer in the middle of the material, and then through external pressure to separate the chip.
Post time: Mar-21-2023