Mu gawo lapakati, China ili pamalo ofooka, ma chip ambiri amafunika kudalira zinthu zochokera kunja, kudalira ena kwa nthawi yayitali, kusowa kwa ufulu wodziyimira pawokha wazinthu zanzeru komanso unyolo wamakampani opita patsogolo ndi otsika. Pa nthawi ya nkhondo yamalonda pakati pa China ndi United States m'zaka zaposachedwa, United States idapereka zilango ku China chifukwa cha nkhani ya ma chip, zomwe zidatipangitsa kuzindikira kufunika kwa ma chip. Kenako mavuto okhudzana ndi kupanga ma chip m'dziko muno atha.
Madera angapo a ukadaulo wamakampani odziwitsa aku China apita patsogolo kwambiri, kupita patsogolo kwa ukadaulo wamakampani odziwitsa, ndi chitukuko cha ukadaulo wolumikizirana wa 6G, dziko lathu lakhala patsogolo. Lakhala dziko loyambira kugwiritsa ntchito ma patent aukadaulo wa 6G, lomwe lili pamalo oyamba padziko lonse lapansi.
Posachedwapa, China idzakhalanso ndi luso lopanga ma chip apamwamba kwambiri. Tikukhulupirira kuti chifukwa cha kusonkhanitsa kosalekeza kwa ukadaulo wathu watsopano, kupanga ma chip ambiri a 7nm kudzachitika posachedwa. Chifukwa cha vuto la ma chip ndikuyimitsa chitukuko cha mafoni am'manja, magalimoto ndi makampani ena aukadaulo kuti apeze chiyembekezo. Kodi makina odulira laser amachita gawo lofunika bwanji popanga ma chip? Pakupanga ma chip, wafer ndiye chinthu chofunikira kwambiri cha chip, ntchito yodulira laser imatha kukwaniritsa zofunikira pakudula ma wafer, ndipo imatha kupewa vuto lodulira mawilo.
1, kukonza kosakhudzana: kukonza laser kokha ndi laser beam ndi processing workpiece contact, palibe mphamvu yodulira ziwalo zodulira, kuti tipewe kuwonongeka pamwamba pa zipangizo zodulira. 2, high machining usahihi, kutentha pang'ono: pulse laser ikhoza kupeza mphamvu yomweyo ndi yayikulu kwambiri, mphamvu zambiri komanso mphamvu yapakati ndi yochepa kwambiri, ikhoza kumalizidwa nthawi yomweyo ndipo malo omwe akhudzidwa ndi kutentha ndi ochepa kwambiri, kuti zitsimikizire kuti machining ndi olondola kwambiri, malo ochepa omwe akhudzidwa ndi kutentha. 3, high processing bwino, ubwino wabwino wazachuma: laser processing bwino nthawi zambiri imakhala ndi zotsatira zingapo za makina ndipo palibe zodetsa. Ukadaulo wodula wosawoneka wa laser wa semiconductor wafer ndi ukadaulo watsopano wodula laser, womwe uli ndi zabwino zambiri, monga liwiro lodula mwachangu, kupanga fumbi, kugwiritsa ntchito substrate, njira yaying'ono yodulira yomwe imafunika, njira youma yonse ndi zina zotero.
Mfundo yaikulu yodulira pogwiritsa ntchito laser ndiyo kuyang'ana kuwala kwa laser komwe kumadutsa pamwamba pa chinthucho pakati pa chinthucho, ndikupanga calcium pakati pa chinthucho, kenako kudzera mu mphamvu yakunja kuti mulekanitse chip.
Nthawi yotumizira: Mar-21-2023
