Kwicandelo le-core, iTshayina ikwimeko ebuthathaka, iitships ezininzi kufuneka zixhomekeke ekungenisweni kwemveliso kwamanye amazwe, ukuxhomekeka kwabanye ixesha elide, ukungabikho kwamalungelo okushicilela azimeleyo kunye nochungechunge lweshishini oluphezulu nolusezantsi. Ngexesha lemfazwe yorhwebo phakathi kweTshayina neMelika kwiminyaka yakutshanje, iMelika yabeka isohlwayo kwiTshayina ngenxa yomba weetships, nto leyo eyasenza saqonda ukubaluleka kweetships. Emva koko ubunzima bokwenziwa kweetships zasekhaya boyiswa.
Amacandelo aliqela eteknoloji yolwazi lwaseTshayina enze inkqubela phambili entle kwimpumelelo yobuchwepheshe bolwazi, ngophuhliso lobuchwepheshe bonxibelelwano lwe-6G, ilizwe lethu liye laphakama. Liye laba lilizwe eliphambili elisebenzisa izicelo zepatenti zobuchwepheshe be-6G, libekwe kwindawo yokuqala kwihlabathi liphela.
Kungekudala, iTshayina iza kuba nakho ukuvelisa iitships eziphezulu. Sikholelwa ukuba phantsi kokuqokelelwa okuqhubekayo kobuchwepheshe bethu obutsha, ukuveliswa ngobuninzi kweetships ze-7nm kuza kwenzeka kungekudala. Ngenxa yengxaki yeetships kunye nokumisa uphuhliso lweefowuni eziphathwayo, iimoto kunye nezinye iinkampani zobuchwepheshe ukubona ithemba. Yeyiphi indima ebalulekileyo edlalwa ngumatshini wokusika i-laser ekuvelisweni kweetships? Kwimveliso yeetships, i-wafer yeyona nto iphambili yetships, umsebenzi wokusika i-laser unokuhlangabezana neemfuno zokusika i-wafer, kwaye unokuphepha ngempumelelo ingxaki yokusika amavili okusila.
1, ukucubungula okungadibaniyo: ukucubungula nge-laser kuphela, umqadi we-laser kunye nokudibanisa umsebenzi, akukho mandla okusika kwiindawo zokusika, ukuthintela umonakalo kumphezulu wezinto zokucubungula. 2, ukuchaneka okuphezulu koomatshini, isiphumo esincinci sobushushu: i-pulse laser inokufikelela kumandla akhawulezileyo aphezulu kakhulu, uxinano lwamandla aphezulu kunye namandla aphakathi aphantsi kakhulu, ingagqitywa ngoko nangoko kwaye indawo echaphazelekileyo bubushushu incinci kakhulu, ukuqinisekisa ukwenziwa komatshini okuchanekileyo, indawo encinci echaphazelekileyo bubushushu. 3, ukusebenza kakuhle koomatshini, iingenelo ezilungileyo zoqoqosho: ukusebenza kakuhle koomatshini kusetyenziswa nge-laser amaxesha amaninzi kwaye akukho zizinto ezisetyenziswayo ezingenangcoliseko. Itekhnoloji yokusika engabonakaliyo ye-laser ye-semiconductor wafer yitekhnoloji entsha yokusika nge-laser, enezibonelelo ezininzi, ezinje ngesantya sokusika esikhawulezayo, akukho kuveliswa kothuli, akukho kusetyenziswa kwe-substrate, indlela yokusika encinci efunekayo, inkqubo epheleleyo yokomisa njalo njalo.
Umgaqo oyintloko wokusika nge-laser kukujolisa umqadi we-laser omfutshane odlula kumphezulu wezinto eziphakathi kwezinto, wenze umaleko we-calcium embindini wezinto, uze emva koko udlule kuxinzelelo lwangaphandle ukuze wahlukanise i-chip.
Ixesha lokuthumela: Matshi-21-2023
