Iyiphi indima edlalwa umshini wokusika nge-laser enqubweni yokukhiqizwa kwama-chip amaningi aseShayina?

Emkhakheni wezinto eziyinhloko, iShayina isesimweni esibuthakathaka, ama-chip amaningi kudingeka athembele ekungenisweni kwamanye amazwe, athembele kwabanye isikhathi eside, ukuntuleka kwamalungelo obunikazi obuzimele kanye nochungechunge lwezimboni oluphezulu noluphansi. Ngesikhathi sempi yokuhweba phakathi kweShayina ne-United States eminyakeni yamuva nje, i-United States yabeka izijeziso eShayina ngendaba yama-chip, okwasenza saqaphela ukubaluleka kwama-chip. Khona-ke ubuchwepheshe obuhlobene nobunzima bokukhiqiza ama-chip basekhaya bunqotshiwe.

Imikhakha eminingana yobuchwepheshe bemboni yolwazi yaseShayina ithuthuke kahle, intuthuko yobuchwepheshe bemboni yolwazi, ngokuthuthukiswa kobuchwepheshe bezokuxhumana be-6G, izwe lethu lihambe phambili. Selibe yizwe eliyinhloko lomthombo wezicelo zelungelo lobunikazi lobuchwepheshe be-6G, libekwe endaweni yokuqala emhlabeni.

Maduze nje, iShayina izoba nekhono lokukhiqiza ama-chip aphezulu. Sikholelwa ukuthi ngaphansi kokuqongelela okuqhubekayo kobuchwepheshe bethu obusha, ukukhiqizwa okukhulu kwama-chip angu-7nm kuzokwenzeka maduze. Ngenxa yenkinga yama-chip nokumisa ukuthuthukiswa kwamafoni aphathwayo, izimoto nezinye izinkampani zobuchwepheshe ukuze sibone ithemba. Iyiphi indima ebalulekile edlalwa umshini wokusika nge-laser ekukhiqizeni ama-chip? Ekukhiqizeni ama-chip, i-wafer iyinto eyinhloko yokusetshenziswa kwama-chip, umsebenzi wokusika nge-laser ungahlangabezana nezidingo zokusika ama-wafer, futhi ungagwema ngempumelelo inkinga yokusika amasondo okugaya.

1, ukucubungula okungathintani: ukucubungula nge-laser kuphela ugongolo lwe-laser kanye nokuxhumana kwe-workpiece yokucubungula, akukho mandla okusika izingxenye zokusika, ukugwema umonakalo ebusweni bezinto zokucubungula. 2, ukunemba okuphezulu komshini wokugaya, umphumela omncane wokushisa: i-pulse laser ingafinyelela amandla asheshayo aphezulu kakhulu, ubuningi bamandla aphezulu kanye namandla ajwayelekile aphansi kakhulu, ingaqedwa ngokushesha futhi indawo ethintekile ukushisa incane kakhulu, ukuqinisekisa ukunemba okuphezulu komshini wokugaya, indawo encane ethintekile ukushisa. 3, ukusebenza kahle kokucubungula okuphezulu, izinzuzo ezinhle zezomnotho: ukusebenza kahle kokucubungula nge-laser kuvame ukuba nomphumela wokucubungula ngomshini izikhathi eziningana futhi akukho okudliwayo okungenakungcola. Ubuchwepheshe bokusika obungabonakali be-laser be-semiconductor wafer buwubuchwepheshe obusha bokusika nge-laser, obunezinzuzo eziningi, njengesivinini sokusika esisheshayo, akukho ukukhiqizwa kothuli, akukho ukusetshenziswa kwe-substrate, indlela encane yokusika edingekayo, inqubo ephelele eyomile njalonjalo.

Isimiso esiyinhloko sokusika nge-laser ukugxila umsebe we-laser omfushane odlula ebusweni bento ephakathi nendawo, kwakhiwe ungqimba lwe-calcium phakathi nendawo, bese kudlula ingcindezi yangaphandle ukuze kuhlukaniswe i-chip.