Munyaya yepakati, China haina simba, machipisi mazhinji anofanira kuvimba nekutenga zvinhu zvinobva kunze kwenyika, kuvimba nevamwe kwenguva refu, kushaya kodzero dzepfuma dzepfungwa dzakazvimiririra uye cheni yeindasitiri yepamusoro neyepasi. Munguva yehondo yekutengeserana pakati peChina neUnited States mumakore achangopfuura, United States yakaisa zvirango kuChina nekuda kwenyaya yemachipisi, izvo zvakaita kuti tizive kukosha kwemachipisi. Zvadaro matambudziko ekugadzira machipisi emuno akakundwa.
Nzvimbo dzinoverengeka dzehunyanzvi hweindasitiri yeruzivo rwekuChina dzakafambira mberi zvakanaka mukubudirira kwetekinoroji yeruzivo, nekuvandudzwa kwetekinoroji yekutaurirana ye6G, nyika yedu yave pamusoro. Yave nyika huru yekushandiswa kwemapatendi ehunyanzvi hwe6G, iri pachinzvimbo chekutanga pasi rose.
Munguva pfupi iri kutevera, China ichange yavawo nekwanisi yekugadzira machipisi emhando yepamusoro. Tinotenda kuti pasi pekuunganidzwa kuri kuitwa tekinoroji yedu itsva, kugadzirwa kwemachipisi e7nm kuchakurumidza kuzadzikiswa. Nekuda kwedambudziko remachipisi uye kumisa kuvandudzwa kwemafoni, mota nedzimwe makambani etekinoroji kuona tariro. Muchina wekucheka nelaser unoita basa rei mukugadzira machipisi? Mukugadzira machipisi, wafer ndiyo chinhu chikuru chemachipisi, basa rekucheka nelaser rinogona kusangana nezvinodiwa zvekucheka wafer, uye rinogona kudzivirira dambudziko rekucheka mavhiri ekukuya.
1, kugadzirisa kusingabatanidzi: laser processing chete laser beam uye processing workpiece contact, hapana simba rekucheka zvikamu zvekucheka, kudzivirira kukuvara pamusoro pezvinhu zvekugadzirisa. 2, high machining usahihi, diki thermal effect: pulse laser inogona kuwana simba pakarepo yakakwira kwazvo, simba rakawanda uye avhareji simba rakaderera kwazvo, inogona kupedzwa ipapo ipapo uye nzvimbo yakanganiswa nekupisa idiki kwazvo, kuve nechokwadi chekuti machining yakanyatsogadzirwa, nzvimbo diki yakanganiswa nekupisa. 3, high processing efficiency, mabhenefiti akanaka ehupfumi: laser processing efficiency inowanzo kuve yakawanda ye mechanical processing effect uye hapana consumables isina kusvibiswa. Laser invisible cutting technology ye semiconductor wafer inyanzvi itsva yekucheka laser, ine mabhenefiti akawanda, akadai sekumhanya nekukurumidza kwekucheka, hapana guruva rekugadzira, hapana substrate consumption, nzira diki yekucheka inodiwa, maitiro akaoma zvakakwana nezvimwewo.
Nheyo huru yekucheka nelaser ndeyekutarisa danda relaser pfupi rinopinda nepamusoro pechinhu chiri pakati pechinhu, zvichiita calcium layer pakati pechinhu, uye wobva wapfuura nekumanikidzwa kwekunze kuti uparadzanise chip.
Nguva yekutumira: Kurume-21-2023
